MOLDING - ELECTRONIC RESIN

Encapsulation (potting) or potting is a coating process allowing the protection of a component, an electronic card or an electronic assembly against shocks and vibrations, but also against environmental stresses (thermal shocks , humidity, chemical attack, salt spray, …).

FEM Technologies is equipped with 2 two-component dosing and mixing machines and vacuum pumps for boiling resins:
➢ over-molding of electronic boards and electrotechnical components: protection function (sealing and confidentiality)
➢ injection of optical resins on LEDs: protection and enhancement function
Since 2016, FEM Technologies has put into operation a robot mixing, ebulling and depositing resin to ensure reliability, accuracy and time.